By Kash L. Mittal
A moment foreign symposium on adhesion points of skinny motion pictures, held in Orlando, Florida in December 2003, improved from the 1st by means of contemplating metalized plastics and adhesion dimension. The 17 papers that caught to the publishing approach transparent to the tip contemplate such themes as adhesion homes of functionally gradient diamond- like carbon nano-composite movies, characterizing polyethylene-metal composite skinny movies deposited through evaporation, the contribution of chemical reactions among aluminum atoms and sorts of useful teams to the adhesion of aluminum-polymer structures, and serious occasions saw on copper motion pictures on glass substrate within the micro-scratch attempt. there's no index. VSP is a subsidiary of Brill.
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Extra resources for Adhesion Aspects of Thin Films
Proc. 1-6 (2000). 6 . P. Wright, C. Anthony, M. Crosbie, P. Donogue, P. Lane and M. Todd, J. Mater. Chem. 14, 3251 (2004). 7. K. Deyand R. Zuleeg, Ferroelectrics 112, 309-319 (1990). 8. C. Chen and D. Ryder, J Am. Ceram. 72, 1495-1502 (1989). 9. N. A. Myers, Mater. Res. Soc. Symp. Proc. 20, 153-158 (1990). 10. J. Bernstein, S. Finberg, K. Houston, L. Niles, H. Chen, L. Cross, K. Li and K. Udayakumar, Proc. IOih IEEE Int. Symp. on Applications ofFerroelectrics, pp. 19-26 (1996). 1 1. L. F. Francis, MRS Bull.
Jpn. 42, 43 (2005). 11. S. Iwamori, Y. Yamada and K. Ikeda, J. Mater. Sci. Jpn. 42, 54 (2005). 12. Y . Kitazaki and T. Hata, J. Jpn. 8, 131 (1972). Adhesion Aspects of Thin Films, Vol. 3 , pp. 3 3 4 6 Ed. L. , Bettis Atomic Power Lab, PO Box 79, West M f l i n , PA 15122, USA Abstract-We have examined the effects of various adhesion layers on the quality, reliability and ferroelectric properties of a PZT stack deposited on a silicon nitride thin film. Although previous research has investigated issues related to adhesion and quality of PZT films, this research considers four specific adhesion layers (Zr, ZrOz, Ti and Ta) deposited onto silicon-nitride-coated substrates and determines qualitatively the most robust and reliable option.
Zuleeg, Ferroelectrics 112, 309-319 (1990). 8. C. Chen and D. Ryder, J Am. Ceram. 72, 1495-1502 (1989). 9. N. A. Myers, Mater. Res. Soc. Symp. Proc. 20, 153-158 (1990). 10. J. Bernstein, S. Finberg, K. Houston, L. Niles, H. Chen, L. Cross, K. Li and K. Udayakumar, Proc. IOih IEEE Int. Symp. on Applications ofFerroelectrics, pp. 19-26 (1996). 1 1. L. F. Francis, MRS Bull. 25, 59-65 (1996). 12. M. Sayer, Z. Wu, V. Kumar, E. T. A m , J Can. Ceram. 65, 124-129 (1993). 13. C. Lee, T. Itoh and T. Suga, IEEE Trans.
Adhesion Aspects of Thin Films by Kash L. Mittal